Factory Lead Time  

15 Weeks

Mount  

Surface Mount

Mounting Type  

Surface Mount

Package / Case  

6-TSSOP, SC-88, SOT-363

Number of Pins  

6

Transistor Element Material  

SILICON

Number of Elements  

2

Turn Off Delay Time  

30.3 ns

Operating Temperature  

-55°C~150°C TJ

Packaging  

Tape & Reel (TR)

Published  

2013

JESD-609 Code  

e3

Part Status  

Active

Moisture Sensitivity Level (MSL)  

1 (Unlimited)

Number of Terminations  

6

ECCN Code  

EAR99

Terminal Finish  

Matte Tin (Sn)

Additional Feature  

HIGH RELIABILITY

Max Power Dissipation  

320mW

Terminal Form  

GULL WING

Peak Reflow Temperature (Cel)  

260

Time@Peak Reflow Temperature-Max (s)  

30

Pin Count  

6

Reference Standard  

AEC-Q101

Configuration  

SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Operating Mode  

ENHANCEMENT MODE

Turn On Delay Time  

4.5 ns

FET Type  

2 N-Channel (Dual)

Transistor Application  

SWITCHING

Rds On (Max) @ Id, Vgs  

190m Ω @ 1.3A, 10V

Vgs(th) (Max) @ Id  

2.8V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds  

87pF @ 20V

Gate Charge (Qg) (Max) @ Vgs  

2nC @ 10V

Rise Time  

8.9ns

Drain to Source Voltage (Vdss)  

30V

Fall Time (Typ)  

15.6 ns

Continuous Drain Current (ID)  

1A

Gate to Source Voltage (Vgs)  

20V

Drain Current-Max (Abs) (ID)  

1A

Drain-source On Resistance-Max  

0.19Ohm

DS Breakdown Voltage-Min  

30V

FET Technology  

METAL-OXIDE SEMICONDUCTOR

FET Feature  

Logic Level Gate

Height  

1mm

Length  

2.2mm

Width  

1.35mm

Radiation Hardening  

No

RoHS Status  

ROHS3 Compliant